GEOLiNK

Capability / Engineering and DFM

Fit the board before you cut the tooling.

Board selection, carrier and thermal review, connector and enclosure fit, and DFM before tooling. Reviews are scoped per project, and the review is a document, not a conversation.

See the outline stack

Reviews are scoped per project; no fixed review turnaround is published until confirmed. Manufacturing is by Piesia.

170 mm
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, front view
ITX660B · 170 × 170 mm
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, rear I/O strip
Rear I/O strip
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, header detail
Header detail

The review order / what can invalidate a design

Enclosure and thermal first.

A dimension error is cheaper to find before tooling. Each item below has a drawing or note behind it.

  • Envelope and mounting 170 × 170, 155 × 117, 146 × 102, 120 × 120, 100 × 100 or 100 × 72 mm.
  • Thermal path Heatsink height, airflow and enclosure material decide the usable CPU tier. The sustained tier is lower than the peak rating.
  • Connector and cable exit Cable exit, bend radius and service access. A plug that clears the board can still block the door.
  • DFM Panelisation, tooling and assembly review before the sample. Tooling is the last place to discover a mismatch.
Illustrative scene: test bench at the manufacturing partner
Illustrative · test
Illustrative scene: outgoing quality check at the manufacturing partner
Illustrative · outgoing check
Illustrative scene: burn-in racks at the manufacturing partner
Illustrative · burn-in
Illustrative scene: board assembly at the manufacturing partner
Illustrative · assembly
Illustrative scene: SMT line at the manufacturing partner
Illustrative · SMT
Review record

Five gates, one document set. Drawing and note per gate.

Review sequence / five gates

Ordered by what can invalidate the design.

Each gate has a deliverable; the next gate starts when it closes. A gate can send the design back one step.

Five review gates A vertical sequence from envelope to thermal, connector, DFM and sample. 01 02 03 04 05
  1. 01

    Envelope and mounting

    Outline, keep-outs and fastener positions against the enclosure drawing. The 170 mm board does not fit a 155 mm opening.

  2. 02

    Thermal path

    Heatsink height, airflow direction and the sustained CPU tier. A 28 W part in a sealed box may run lower.

  3. 03

    Connector and cable exit

    Plug heights, bend radius and service access. Service access is part of the fit.

  4. 04

    DFM

    Panelisation, tooling and assembly before the sample is released. Panel and fixture review comes first.

  5. 05

    Sample

    First article for fit and function, checked against the request.

Dimension stack / drawn to scale

Six outlines, one scale.

The drawing is to scale; the labels are the catalog values.

Six form-factor outlines at one scale 170 by 170, 155 by 117, 146 by 102, 120 by 120, 100 by 100 and 100 by 72 millimetres drawn at 1.2 pixels per millimetre. 170 × 170 mm 155 × 117 mm 146 × 102 mm 120 × 120 mm 100 × 100 mm 100 × 72 mm 1.2 px = 1 mm catalog dimensions
A mechanical drawing is supplied per model on request. The 170 mm outline sets the upper bound. The stack is a comparison, not a manufacturing drawing.

Scroll to see all six outlines.

Risk to review step

What each gate catches.

Risk Gate Deliverable
Mounting conflict Envelope and mounting Keep-out and fastener drawing
Thermal throttling Thermal path Heatsink and airflow note
Connector clash Connector and cable exit Cable-exit drawing
Tooling rework DFM Tooling review
Sample mismatch Sample First-article check

Review bases / three models

Three envelopes that reach review often.

The outline difference decides the first question.

ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, front view ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm, PCIe slot area
170 × 170 mm

ITX660B

PCIe 4.0 ×16, 65 W TDP and 12–24 V. A review base for accelerator or multi-display nodes. The 170 mm outline leaves room for a card.

RP7003AW industrial motherboard, 3.5-inch, 146 × 102 mm, front view RP7003AW industrial motherboard, 3.5-inch, 146 × 102 mm, board detail
146 × 102 mm

RP7003AW

Two CAN headers, M.2 B-Key and 9–36 V. A review base for DIN-rail gateways. The 146 mm outline suits a compact gateway enclosure.

AD600Z3AW industrial motherboard, 3.5-inch Wide, 155 × 117 mm, front view AD600Z3AW industrial motherboard, 3.5-inch Wide, 155 × 117 mm, I/O edge
155 × 117 mm

AD600Z3AW

28 W, 9–36 V and LVDS/eDP. A review base for panel-PC and kiosk enclosures. The 155 mm outline sits between the two sizes.

Before the review

Three review questions, answered.

Do you review my enclosure?

Yes, as a scoped review. Send the drawing, the board choice and the thermal load; the review is confirmed per project. A 3D model shortens the review.

What do you need to start?

Board model or form factor, enclosure drawing, connector list and operating range. A 3D model helps if you have one.

What is not covered?

No fixed review turnaround is published until confirmed. Certification of the finished equipment stays with the integrator.

Engineering and DFM / scoped inquiry

Send the enclosure drawing with the board choice.

Reviews are scoped per project. Include the target enclosure material. Quote within 24–48 h; open terms confirmed at quotation.

Manufacturing is by Piesia. No fixed review turnaround is published until confirmed.

Illustrative scene: an electronics production line Illustrative scene