Design guide 01 / enclosure fit

Six envelopes. One true scale.

The board you choose is the space you give it. Compare the six catalog envelopes at one scale, then check mounting, connector height and heatsink clearance.

170 × 170155 × 117146 × 102120 × 120100 × 100100 × 72mm

Browse all envelopes
ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm
ITX660B · Mini-ITX · 170 × 170 mm

True-scale outlines

The size difference is the argument.

Six form factors drawn at one scale Six outlines at one scale: Mini-ITX 170 × 170, 3.5-inch Wide 155 × 117, 3.5-inch 146 × 102, NANO-ITX 120 × 120, NUC 100 × 100, 2.5-inch 100 × 72 mm. MINI-ITX 170 × 170 mm 3.5-INCH WIDE 155 × 117 mm 3.5-INCH 146 × 102 mm NANO-ITX 120 × 120 mm NUC 100 × 100 mm 2.5-INCH 100 × 72 mm

All six outlines are drawn at the same scale. Dimensions are catalog values; 28 models sit inside these six envelopes.

Enclosure check / four measurements

The envelope is not the fit.

Dimensions decide the footprint; four checks decide whether the board goes in.

  • Mounting holesCheck the pattern per model.
  • Connector heightMeasure the tallest header.
  • Cable exitLeave a bend radius.
  • Heatsink clearanceBoard rating is not a case rating.

A 146 × 102 mm board with a 25 mm heatsink needs more internal depth: the outline is a footprint, not a clearance.

ITX660B industrial motherboard, Mini-ITX, 170 × 170 mm
ITX660B · check the mounting pattern and the tallest connector.

Six form factors

Compare on the deciding criteria.

Form factorDimensionsDC inputExpansionCOM / LANCoolingModels
2.5-inch100 × 72 mm12 VM.2 M-Key2 / 1Fan optional4
3.5-inch146 × 102 mm9–36 VM.2 + SATAup to 6 / 2Heatsink4
3.5-inch Wide155 × 117 mm9–36 VM.2 + SATA + CAN6 / 2Heatsink2
NANO-ITX120 × 120 mm9–36 VM.2 per modelup to 5 / 4Fanless5
NUC100 × 100 mm12–19 VM.2 + SATAUSB / 1–2 LANFanless6
Mini-ITX170 × 170 mm12–19 / 24 VPCIe on some modelsup to 6 / 2Heatsink/fan7

Selection order / four cuts

Cut in this order, not in circles.

Form-factor selection order Four cuts in order: envelope, I/O count, power range, then temperature and lifecycle. CUT 01 Envelope CUT 02 I/O count CUT 03 Power range CUT 04 Temperature

The envelope removes the most options first; temperature and lifecycle decide the final model.

Model shortlist / one per envelope

Six models, six envelopes.

One model per envelope; the catalog holds 28. Ask for the spec card before layout freeze.

Edge detail / what the outline hides

Four places the drawing stops.

AD742A industrial motherboard, 2.5-inch SBC, 100 × 72 mm, I/O edge
AD742A · 2.5-inch edge and headers
MSK-TL5003AW industrial motherboard, 3.5-inch SBC, 146 × 102 mm, COM headers
MSK-TL5003AW · COM header stack
PNM-5210 industrial motherboard, NANO-ITX, 120 × 120 mm, LAN ports
PNM-5210 · LAN stack and edge
AD600Z3AW industrial motherboard, 3.5-inch Wide, 155 × 117 mm, I/O edge
AD600Z3AW · wide I/O edge

Boundary / board vs system

What stays with the integrator.

The catalog gives the envelope and the board rating. The enclosure, airflow path and finished-system validation stay with the integrator.

  • Mount patternVerified against the drawing
  • Thermal testRun in the finished enclosure
  • EMCTested at equipment level
  • Shock and vibrationValidated with the mounting design

Before the shortlist

Three questions the table cannot settle.

Does this apply to my model?

Dimensions are catalog values; hole patterns and connector positions are checked per model.

Is the protection level documented?

No protection level is stated on the spec cards; confirm it before design freeze.

What must I validate in my enclosure?

Hole pattern, connector height, cable exit, heatsink clearance and enclosure temperature.

Next step / model shortlist

Send the enclosure and the I/O count.

Send the internal envelope, connector height and operating range for the closest model. Quote within 24–48 h.

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Illustrative data-centre aisle with server racks
Illustrative scene, server rack aisle. Not a site photograph.